S-AU82AH Datasheet, PDF (3/5 Pages) Toshiba Semiconductor – RF POWER AMPLIFIER MODULE FM RF POWER AMPLIFIER MODULE FOR 60-W COMMERCIAL UHF RADIO APPLICATIONS

S-AU82AH
HANDLING PRECAUTIONS
ï½¥ Since this product has a protective cap, care should be taken to avoid applying an excessive impact and allowing
foreign objects to get inside when handling this product. Also, please do not remove a cap. If the cap is removed,
the foreign object inside the module or the applied impact may lead IC failure, causing smoke or ignition.
ï½¥ Since this product is structurally susceptible to static electricity, protections against the static electricity should be
applied to objects that may come in direct contact with devices, such as worktables, equipment, operators and
solder irons.
・This product is not designed nor intended to perform a continuous transmission for applications like a base station.
Please do not use this product for such applications, for the reliability cannot be guaranteed.
・This product is intended to be used for a single operation (single-device operation). A proper operation is not
guaranteed for a parallel operation. A parallel operation should be performed in accordance with your own good
judgment.
・Mounting method
・The flatness of a heat sink must not exceed 50 μm. If the flatness exceeds 50 μm, the device may experience
an unexpected stress that may lead to module breakdown due to damage or ignition in the substrate inside a
module and other module parts.
・Please apply thermal compound between a module and a heat sink to improve the adhesive property.
・Use a 4-mm diameter screw with the clamping screw torque of 1.2 to 1.5 Nm.
・Please solder the module leads after the screw is clamped.
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2007-06-21