CMG02 Datasheet, PDF (3/4 Pages) Toshiba Semiconductor – General Purpose Rectifier Applications

100
Pulse test
i_F – v_F
Tj = 150°C
10
75°C
1
0.1
25°C
0.01
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
Instantaneous forward voltage vF (V)
CMG02
P_{F (AV)} – I_{F (AV)}
2.4
2.2 ^{Halfsine waveform}
2.0
1.8
0°
180°
1.6
Conduction angle 180°
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
Average forward current I_{F (AV)} (A)
Tℓ max – I_{F (AV)}
160
140
120
100
80
60
Halfsine waveform
40
20
0°
180°
Conduction angle 180°
0
0.0 0.2 0.4 0.6 0.8 1.0
1.2 1.4 1.6 1.8
2.0 2.2
Average forward current I_{F (AV)} (A)
160
140
Ta max – IF (AV)
Device mounted on a ceramic board:
Soldering land: 2.0 mm × 2.0 mm
Halfsine waveform
120
100
80
60
40
0°
180°
Conduction angle 180°
Device mounted on a glass-epoxy board:
Soldering land: 6.0 mm × 6.0 mm
Device mounted on a glass-epoxy board:
Soldering land: 2.1 mm × 1.4 mm
20
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
Average forward current I_{F (AV)} (A)
Surge forward current
(non-repetitive)
100
90
80
70
60
50
40
30
20
10
0
1
35
10
30 50
100
Number of cycles
r_{th (j-a)} – t
1000
Device mounted on a glass-epoxy
board:
board size: 50 mm × 50 mm
Soldering land: 2.1 mm × 1.4 mm
100 board thickness: 1.6 t
Device mounted on a glass-epoxy
board:
10
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 t
1
0.1
0.001
Device mounted on a ceramic
board:
board size: 50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness: 0.64 t
0.01
0.1
1
10
100 1000
Time t (s)
3
2006-11-06