CMF05 Datasheet, PDF (3/6 Pages) Toshiba Semiconductor – High-Speed Rectifier Applications (Fast Recovery)

CMF05
2) Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device.
When using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal
resistance value.
Refer to the Rectifier databook for further information.
3) Moisture-Proof Packing
The CMF05 is packed in a moisture-proof laminated aluminum bag.
Precautions for Transportation and Storage
(1) Avoid excessive vibration during transportation.
(2) Do not toss or drop the packed devices to avoid ripping of the bag.
(3) After opening the moisture-proof bag, the devices should be stored at a temperature of 5°C to 30°C and at an RH
of 70% or below. The devices should be assembled within the defined period.
Reflow Soldering Conditions:
First reflow soldering:
Second reflow soldering:
Third reflow soldering:
Within 120 hours after opening the moisture-proof bag
Within 72 hours after the first reflow soldering
Within 72 hours after the second reflow soldering
Flow Soldering Conditions:
Perform flow soldering within 120 hours after opening the moisture-proof bag. Flow soldering is permitted at
most once.
Preheat the devices for 60 to 120 seconds at a temperature of 150°C.
(4) The moisture-proof bag may be stored unopened for up to 12 months at 5°C to 30°C at an RH of 90% or below.
If, upon opening the bag, the moisture indicator card shows humidity of 30% or above (the color of the 30% dot has
changed from blue to pink) or the expiration date has passed, the devices should be baked as follows:
Baking conditions: 60°C ± 5°C for 24 to 36 hours. Perform baking at most once.
Repeated baking can cause the peeling strength of the tape to change and lead to an assembly problem.
Furthermore, countermeasures against static electricity should be taken during baking.
30%
The humidity indicator shows an approximate ambient humidity at 25°C.
If the ambient humidity is below 10%, the color of all the indicator dots is blue.
If, upon opening the bag, the color of the 30% dot has changed from blue to pink,
the devices should be baked before assembly.
4) Mounting Method
ï½¥Using Infrared Reflow
(1) Heating the top and bottom with long or medium infrared rays is recommended (see Figure 1).
Device flow
Medium infrared ray heater
(Reflow heater)
Long infrared ray heater (preheater)
Figure 1 Heating the top and bottom with long or medium infrared rays
(2) Complete the infrared ray reflow process within 30 to 50 seconds when a package surface temperature is 230°C
or higher. The maximum package surface temperature should be kept below 260°C.
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2010-02-17