TLP3107 Datasheet, PDF (2/9 Pages) Toshiba Semiconductor – Normally off (1-Form-A)

5. Internal Circuit
TLP3107
6. Absolute Maximum Ratings (Note) (Unless otherwise specified, T_a = 25 )
Characteristics
Symbol Note
Rating
Unit
LED Input forward current
I_F
30
mA
Input forward current derating
(T_a ≥ 25 )
∆I_F/∆T_a
-0.3
mA/
Input forward current (pulsed)
(100 µs pulse, 100 pps)
I_FP
1
A
Input reverse voltage
V_R
5
V
Input power dissipation
P_D
50
mW
Junction temperature
T_j
125

Detector OFF-state output terminal voltage
V_OFF
60
V
ON-state current (A connection)
I_ON
(Note 1)
3.3
A
ON-state current (B connection)
I_ON
(Note 1)
3.3
ON-state current (C connection)
I_ON
(Note 1)
6.6
ON-state current derating (A connection)
(T_a ≥ 25 )
∆I_ON/∆T_a (Note 1)
-33
mA/
ON-state current derating (B connection)
(T_a ≥ 25 )
∆I_ON/∆T_a (Note 1)
-33
ON-state current derating (C connection)
(T_a ≥ 25 )
∆I_ON/∆T_a (Note 1)
-66
ON-state current (pulsed)
(t = 100 ms, Duty = 1/10)
I_ONP
10
A
Output power dissipation
P_O
430
mW
Junction temperature
T_j
125

Common Storage temperature
T_stg
-55 to 125
Operating temperature
T_opr
-40 to 85
Lead soldering temperature
(10 s)
T_sol
260
Isolation voltage
AC, 1 min, R.H. ≤ 60 %
BV_S
(Note 2)
1500
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: For an application circuit example, see Fig. 12.2.
Note 2: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6
are shorted together.
2
2013-09-19
Rev.1.0