TLP2601_07 Datasheet, PDF (2/9 Pages) Toshiba Semiconductor – Simplex / Multiplex Data Transmission

Recommended Operating Conditions
TLP2601
Characteristic
Symbol
Min.
Typ.
Max. Unit
Input current, low level
Input current, high level
Supply voltage**, output
High level enable voltage
Low level enable voltage
Fan out (TTL load)
Operating temperature
I_FL
0
⎯
250
μA
I_FH
6.3 (*) ⎯
20
mA
V_CC
4.5
⎯
5.5
V
V_EH
2.0
⎯
V_CC
V
V_EL
0
⎯
0.8
V
N
⎯
⎯
8
⎯
T_opr
0
⎯
70
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
(*) 6.3mA is a guard banded value which allows for at least 20% CTR degradation.
Initial input current threshold value is 5.0mA or less.
**This item denotes operating ranges, not meaning of recommended operating conditions.
Absolute Maximum Ratings (no derating required)
Characteristic
Symbol
Rating
Unit
Forward current
I_F
20
mA
Reverse voltage
V_R
Output current
I_O
Output voltage
V_O
Supply voltage
V_CC
(1 minute maximum)
Enable input voltage
V_E
(not to exceed V_CC by more than 500mV)
Output collector power dissipation
P_o
Operating temperature range
T_opr
Storage temperature range
T_stg
Lead solder temperature (10s)
(**)
T_sol
Isolation voltage
(R.H.≤ 60%,AC 1min.,
BV_S
(Note 10)
5
V
25
mA
−0.5~7
V
7
V
5.5
40
−40~85
−55~125
260
2500
3540
V
mW
°C
°C
°C
Vrms
V_dc
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(**) 1.6mm below seating plane.
2
2007-10-01