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TLP2105 Datasheet, PDF (2/11 Pages) Toshiba Semiconductor – PHOTOCOUPLER GaAℓAs Ired & PHOTO-IC
TLP2105
Absolute Maximum Ratings (Ta=25°C)
CHARACTERISTIC
SYMBOL RATING UNIT
Forward Current
(Note 1)
Forward current derating (Ta≥75°C)
IF
ΔIF/ΔTa
20
-0.48
mA
mA/°C
Peak Transient Forward Current (Note 1,2)
IFPT
1
A
Reverse Voltage
(Note 1)
VR
5
V
Output Current 1 (Ta ≤ 25℃) (Note 1)
IO1
25/-15
mA
Output Current 2 (Ta = 100℃) (Note 1)
IO2
5/-5
mA
Output Voltage
(Note 1)
VO
-0.5 to 20
V
Supply Voltage
VCC -0.5 to 20
V
Operating Temperature Range
Topr -40 to 100
°C
Storage Temperature Range
Tstg -55 to 125
°C
Lead Soldering Temperature (10 s)
Tsol
260
°C
Isolation Voltage
(AC,1 min, R.H.≤ 60%,Ta=25°C)
(Note 3)
BVs
2500
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Each Channel.
Note 2: Pulse width ≤ 1μs, 300 pps.
Note 3: This device is regarded as a two terminal device: pins 1, 2, 3 and 4 are shorted together,
as are pins 5, 6, 7 and 8.
Recommended Operating Conditions
CHARACTERISTIC
SYMBOL MIN TYP. MAX UNIT
Input Current , ON
Input Voltage , OFF
Supply Voltage*
Operating Temperature
IF(ON)
2
―
10
mA
VF(OFF)
0
―
0.8
V
VCC
4.5
―
20
V
Topr
-40
―
100
°C
* This item denotes operating range, not meaning of recommended operating conditions.
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
2
2008-11-26