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SSM3K01T_07 Datasheet, PDF (2/5 Pages) Toshiba Semiconductor – High Speed Switching Applications
Marking
3
Equivalent Circuit
3
SSM3K01T
KW
1
2
1
2
Electrical Characteristics (Ta = 25°C)
Characteristic
Gate leakage current
Drain-Source breakdown voltage
Drain Cut-off current
Gate threshold voltage
Forward transfer admittance
Drain-Source ON resistance
Drain-Source ON resistance
Input capacitance
Reverse transfer capacitance
Output capacitance
Switching time
Turn-on time
Turn-off time
Note3: Pulse test
Symbol
Test Condition
Min Typ. Max Unit
IGSS
VGS = ±10 V, VDS = 0
⎯
⎯
±1
μA
V (BR) DSS ID = 1 mA, VGS = 0
30
⎯
⎯
V
IDSS
VDS = 30 V, VGS = 0
⎯
⎯
1
μA
Vth
VDS = 3 V, ID = 0.1 mA
0.6
⎯
1.1
V
|Yfs|
VDS = 3 V, ID = 1.6 A
(Note3) 2.6 5.2
⎯
S
RDS (ON) ID = 1.6 A, VGS = 4 V
(Note3) ⎯
85 120 mΩ
RDS (ON) ID = 1.3 A, VGS = 2.5 V
(Note3) ⎯
115 150 mΩ
Ciss
VDS = 10 V, VGS = 0, f = 1 MHz
⎯ 152 ⎯
pF
Crss
VDS = 10 V, VGS = 0, f = 1 MHz
⎯
41
⎯
pF
Coss
VDS = 10 V, VGS = 0, f = 1 MHz
⎯ 102 ⎯
pF
ton
VDD = 15 V, ID = 0.5 A
toff
VGS = 0~2.5 V, RG = 4.7 Ω
⎯
45
⎯
nS
⎯
69
⎯
Switching Time Test Circuit
(a) Test circuit
10 μs
2.5 V
IN
0
ID
VDD = 15 V
OUT RG = 4.7 Ω
D.U. <= 1%
VIN: tr, tf < 5 ns
COMMON SOURCE
Ta = 25°C
VDD
(b) VIN
VGS
(c) VOUT
VDS
2.5 V
0
VDD
VDS (ON)
10%
tr
ton
90%
10%
90%
tf
toff
Precaution
Vth can be expressed as voltage between gate and source when low operating current value is ID = 100 μA for
this product. For normal switching operation, VGS (on) requires higher voltage than Vth and VGS (off) requires
lower voltage than Vth.
(relationship can be established as follows: VGS (off) < Vth < VGS (on))
Please take this into consideration for using the device.
2
2007-11-01