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GT50J325_06 Datasheet, PDF (2/7 Pages) Toshiba Semiconductor – Silicon N Channel IGBT High Power Switching Applications | |||
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Electrical Characteristics (Ta = 25°C)
GT50J325
Characteristics
Symbol
Test Condition
Min Typ. Max Unit
Gate leakage current
Collector cut-off current
Gate-emitter cut-off voltage
Collector-emitter saturation voltage
Input capacitance
Turn-on delay time
Rise time
Turn-on time
Switching time
Turn-off delay time
Fall time
Turn-off time
Switching loss
Turn-on switching
loss
Turn-off switching
loss
Peak forward voltage
Reverse recovery time
IGES
ICES
VGE (OFF)
VCE (sat)
Cies
VGE = ±20 V, VCE = 0
VCE = 600 V, VGE = 0
IC = 5 mA, VCE = 5 V
IC = 50 A, VGE = 15 V
VCE = 10 V, VGE = 0, f = 1 MHz
â¯
⯠±500 nA
â¯
â¯
1.0 mA
3.5
â¯
6.5
V
â¯
2.0 2.45
V
⯠7900 â¯
pF
td (on)
⯠0.09 â¯
tr
⯠0.07 â¯
ton
td (off)
tf
toff
Eon
Eoff
Inductive load
VCC = 300 V, IC = 50 A
VGG = +15 V, RG = 13 Ω
⯠0.24 â¯
μs
⯠0.30 â¯
⯠0.05 â¯
(Note 1)
â¯
0.43
â¯
(Note 2)
⯠1.30 â¯
mJ
⯠1.34 â¯
VF
IF = 50 A, VGE = 0
trr
IF = 50 A, di/dt = â100 A/μs
â¯
â¯
4.2
V
â¯
65
â¯
ns
Note 1: Switching time measurement circuit and input/output waveforms
âVGE
IC
RG
L VCC
VCE
VGE
0
90%
IC
90%
0 VCE
10%
td (off)
tf
toff
10%
10%
90%
10%
td (on)
tr
ton
10%
Note 2: Switching loss measurement waveforms
VGE
0
90%
10%
IC
0 VCE
Eoff
5%
Eon
2
2006-11-01
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