English
Language : 

GT50J325_06 Datasheet, PDF (2/7 Pages) Toshiba Semiconductor – Silicon N Channel IGBT High Power Switching Applications
Electrical Characteristics (Ta = 25°C)
GT50J325
Characteristics
Symbol
Test Condition
Min Typ. Max Unit
Gate leakage current
Collector cut-off current
Gate-emitter cut-off voltage
Collector-emitter saturation voltage
Input capacitance
Turn-on delay time
Rise time
Turn-on time
Switching time
Turn-off delay time
Fall time
Turn-off time
Switching loss
Turn-on switching
loss
Turn-off switching
loss
Peak forward voltage
Reverse recovery time
IGES
ICES
VGE (OFF)
VCE (sat)
Cies
VGE = ±20 V, VCE = 0
VCE = 600 V, VGE = 0
IC = 5 mA, VCE = 5 V
IC = 50 A, VGE = 15 V
VCE = 10 V, VGE = 0, f = 1 MHz
⎯
⎯ ±500 nA
⎯
⎯
1.0 mA
3.5
⎯
6.5
V
⎯
2.0 2.45
V
⎯ 7900 ⎯
pF
td (on)
⎯ 0.09 ⎯
tr
⎯ 0.07 ⎯
ton
td (off)
tf
toff
Eon
Eoff
Inductive load
VCC = 300 V, IC = 50 A
VGG = +15 V, RG = 13 Ω
⎯ 0.24 ⎯
μs
⎯ 0.30 ⎯
⎯ 0.05 ⎯
(Note 1)
⎯
0.43
⎯
(Note 2)
⎯ 1.30 ⎯
mJ
⎯ 1.34 ⎯
VF
IF = 50 A, VGE = 0
trr
IF = 50 A, di/dt = −100 A/μs
⎯
⎯
4.2
V
⎯
65
⎯
ns
Note 1: Switching time measurement circuit and input/output waveforms
−VGE
IC
RG
L VCC
VCE
VGE
0
90%
IC
90%
0 VCE
10%
td (off)
tf
toff
10%
10%
90%
10%
td (on)
tr
ton
10%
Note 2: Switching loss measurement waveforms
VGE
0
90%
10%
IC
0 VCE
Eoff
5%
Eon
2
2006-11-01