CMF02TE12L.Q Datasheet, PDF (2/4 Pages) Toshiba Semiconductor – Switching Mode Power Supply Applications DC/DC Converter Applications

Electrical Characteristics (Ta = 25°C)
Characteristic
Peak forward voltage
Repetitive peak reverse current
Reverse recovery time
Forward recovery time
Thermal resistance
Thermal resistance (junction to lead)
Symbol
V_FM
I_RRM
t_rr
t_fr
R_th(j-a)
R_th(j-ℓ)
Test Condition
I_FM = 1.0 A (pulse test)
V_RRM = 600 V (pulse test)
I_F = 1 A, di/dt =-30 A/μs
I_F = 1 A
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 mm)
Device mounted on a glass-epoxy
board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 mm)
Device mounted on a glass-epoxy
board
(board size: 50 mm × 50 mm)
(soldering land: 2.1 mm × 1.4 mm)
(board thickness: 1.6 mm)
⎯
CMF02
Min Typ. Max Unit
⎯
⎯
2.0
V
⎯
⎯
50
μA
⎯
⎯
100
ns
⎯ 270 ⎯
ns
⎯
⎯
60
⎯
⎯
135 _°C/W
⎯
⎯
210
⎯
⎯
16 °C/W
Marking
Abbreviation Code
F2
Part No.
CMF02
Standard Soldering Pad
Unit: mm
1.4
3.0
1.4
Handling Precautions
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings.
The following are the general derating methods we recommend for designing a circuit using this device.
V_RRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the absolute
maximum rating of V_RRM for a DC circuit and be no greater than 50% of that of V_RRM for an AC circuit.
V_RRM has a temperature coefficient of 0.1%/℃. Take this temperature coefficient into account designing a device
at low temperature.
I_F(AV): We recommend that the worst-case current be no greater than 80% of the absolute maximum rating of I_F(AV).
Carry out adequate heat design. If you can’t design a circuit with excellent heat radiation, set the margin by using
an allowable Ta max- I_F(AV) curve.
This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180. Therefore,
this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device.
We recommend that a device be used at Tj below 120℃ under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using
a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Refer to the Rectifier databook for further information.
2
2008-05-13