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2SJ681Q Datasheet, PDF (2/6 Pages) Toshiba Semiconductor – Relay Drive, DC−DC Converter and Motor Drive Applications
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Gate leakage current
Drain cut−off current
Drain−source breakdown voltage
Gate threshold voltage
Drain−source ON resistance
Forward transfer admittance
Input capacitance
Reverse transfer capacitance
Output capacitance
Rise time
Turn−on time
Switching time
Fall time
Turn−off time
Total gate charge (Gate−source
plus gate−drain)
Gate−source charge
Gate−drain (“miller”) charge
IGSS
IDSS
V (BR) DSS
V (BR) DSX
Vth
RDS (ON)
|Yfs|
Ciss
Crss
Coss
tr
ton
tf
toff
VGS = ±16 V, VDS = 0 V
VDS = −60 V, VGS = 0 V
ID = −10 mA, VGS = 0 V
ID = −10 mA, VGS = 20 V
VDS = −10 V, ID = −1 mA
VGS = −4 V, ID = −2.5 A
VGS = −10 V, ID = −2.5 A
VDS = −10 V, ID = −2.5 A
VDS = −10 V, VGS = 0 V, f = 1 MHz
0V
VGS
−10 V
ID = −2.5 A
Output
RL =
12 Ω
VDD ≈ −30 V
Duty ≤ 1%, tw = 10 μs
Qg
Qgs
VDD ≈ −48 V, VGS = −10 V, ID = −5 A
Qgd
2SJ681
Min Typ. Max Unit
—
—
±10
μA
—
— −100 μA
−60 —
—
V
−35 —
—
V
−0.8 —
−2.0
V
— 0.16 0.25
Ω
— 0.12 0.17
2.5 5.0
—
S
— 700 —
—
60
—
pF
—
90
—
—
14
—
—
24
—
ns
—
14
—
—
95
—
—
15
—
—
11
—
nC
—
4
—
Source-Drain Ratings and Characteristics (Ta = 25°C)
Characteristics
Continuous drain reverse current
(Note 1)
Pulse drain reverse current
(Note 1)
Forward voltage (diode)
Reverse recovery time
Reverse recovery charge
Symbol
IDR
IDRP
VDSF
trr
Qrr
Test Condition
—
—
IDR = −5 A, VGS = 0 V
IDR = −5 A, VGS = 0 V
dlDR / dt = 50 A / μs
Min Typ. Max Unit
—
—
−5
A
—
—
−20
A
—
—
1.7
V
—
40
—
ns
—
32
—
nC
Marking
J681
Note 4: A line under a Lot No. identifies the indication of product
Part No. (or abbreviation code)
Labels.
Lot No.
Note 4
[[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]
Please contact your TOSHIBA sales representative for details as to
environmental matters such as the RoHS compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament
and of the Council of 27 January 2003 on the restriction of the use of
certain hazardous substances in electrical and electronic equipment.
2
2010-03-01