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2SJ668 Datasheet, PDF (2/6 Pages) Toshiba Semiconductor – Silicon P-Channel MOS Type Relay Drive, DC/DC Converter and Motor Drive Applications
Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Gate leakage current
Drain cutoff current
Drain−source breakdown voltage
Gate threshold voltage
Drain−source ON-resistance
Forward transfer admittance
Input capacitance
Reverse transfer capacitance
Output capacitance
Rise time
Turn−on time
Switching time
Fall time
Turn−off time
Total gate charge (gate−source
plus gate−drain)
Gate−source charge
Gate−drain (“Miller”) charge
IGSS
IDSS
V (BR) DSS
V (BR) DSX
Vth
RDS (ON)
|Yfs|
Ciss
Crss
Coss
tr
ton
tf
toff
VGS = ±16 V, VDS = 0 V
VDS = −60 V, VGS = 0 V
ID = −10 mA, VGS = 0 V
ID = −10 mA, VGS = 20 V
VDS = −10 V, ID = −1 mA
VGS = −4 V, ID = −2.5 A
VGS = −10 V, ID = −2.5 A
VDS = −10 V, ID = −2.5 A
VDS = −10 V, VGS = 0 V, f = 1 MHz
0V
VGS
−10 V
ID = −2.5 A
Output
RL =
12 Ω
VDD ∼− −30 V
Duty <= 1%, tw = 10 μs
Qg
Qgs
VDD ≈ −48 V, VGS = −10 V, ID = −5 A
Qgd
2SJ668
Min Typ. Max Unit
—
—
±10
μA
—
— −100 μA
−60 —
—
V
−35 —
—
V
−0.8 —
−2.0
V
— 0.16 0.25
Ω
— 0.12 0.17
2.5 5.0
—
S
— 700 —
—
60
—
pF
—
90
—
—
14
—
—
24
—
ns
—
14
—
—
95
—
—
15
—
—
11
—
nC
—
4
—
Source-Drain Ratings and Characteristics (Ta = 25°C)
Characteristic
Continuous drain reverse current
(Note 1)
Pulse drain reverse current
(Note 1)
Forward voltage (diode)
Reverse recovery time
Reverse recovery charge
Symbol
IDR
IDRP
VDSF
trr
Qrr
Test Condition
—
—
IDR = −5 A, VGS = 0 V
IDR = −5 A, VGS = 0 V
dlDR / dt = 50 A / μS
Min Typ. Max Unit
—
—
−5
A
—
—
−20
A
—
—
1.7
V
—
40
—
ns
—
32
—
nC
Marking
J668
Part No. (or abbreviation code)
Lot No.
A line indicates
lead (Pb)-free package or
lead (Pb)-free finish.
2
2006-11-17