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TB7101AF Datasheet, PDF (1/22 Pages) Toshiba Semiconductor – Buck DC-DC Converter IC
TB7101AF(T5L1.2,F)/(T5L1.5,F)/(T5L1.8,F)/(T5L2.5,F)/(T5L3.3,F)
Toshiba BiCD Integrated Circuit Silicon Monolithic
TB7101AF(T5L1.2,F),TB7101AF(T5L1.5,F)
TB7101AF(T5L1.8,F),TB7101AF(T5L2.5,F)
TB7101AF(T5L3.3,F)
Buck DC-DC Converter IC
The TB7101AF is a single-chip buck DC-DC converter IC. The
TB7101AF contains high-speed and low-on-resistance power
MOSFETs for the main switch and synchronous rectifier to
achieve high efficiency.
Features
• Enables up to 1 A of load current (IOUT) with a minimum of
external components.
Weight: 0.017 g (typ.)
• Fixed output voltage: VOUT = 1.2 V/1.5 V/1.8 V/2.5 V/3.3 V (typ.)
• A high 1-MHz oscillation frequency (typ.) allows the use of small external components.
• Uses only an inductor and two capacitors to achieve high efficiency.
• Allows the use of a small surface-mount ceramic capacitor as an output filter capacitor.
• Enable threshold voltage : VIH(EN) = 1.5 V, VIL(EN) = 0.5 V(@VIN = 5 V)
• Housed in a small surface-mount package (PS-8) with a low thermal resistance.
• Undervoltage lockout (UVLO), thermal shutdown (TSD) and overcurrent protection (OCP)
Parts Marking
Pin Assignment
Product
Output
Parts
Voltage (V) Marking
TB7101AF
(T5L1.2, F)
1.2
7101F
TB7101AF
(T5L1.5, F)
1.5
7101G
TB7101AF
(T5L1.8, F)
1.8
7101H
TB7101AF
(T5L2.5, F)
2.5
7101J
TB7101AF
(T5L3.3, F)
3.3
7101K
Parts Marking
Lot No.
*
The dot (•) on the top surface indicates pin 1.
LX VFB N.C. N.C.
8
7
6
5
1
2
PGND VIN
3
4
EN SGND
*: The lot number consists of three digits. The first digit represents the last digit of the year of manufacture, and the
following two digits indicates the week of manufacture between 01 and either 52 or 53.
Manufacturing week code
(The first week of the year is 01; the last week is 52 or 53.)
Manufacturing year code (last digit of the year of manufacture)
This product has a MOS structure and is sensitive to electrostatic discharge. Handle with care.
The product(s) in this document (“Product”) contain functions intended to protect the Product from temporary
small overloads such as minor short-term overcurrent, or overheating. The protective functions do not necessarily
protect Product under all circumstances. When incorporating Product into your system, please design the system (1)
to avoid such overloads upon the Product, and (2) to shut down or otherwise relieve the Product of such overload
conditions immediately upon occurrence. For details, please refer to the notes appearing below in this document and
other documents referenced in this document.
1
2008-05-22