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SSM6H19NU Datasheet, PDF (1/11 Pages) Toshiba Semiconductor – Composite Devices Silicon N-Channel MOS/Epitaxial Schottky Barrier
Composite Devices Silicon N-Channel MOS/Epitaxial Schottky Barrier
SSM6H19NU
1. Applications
• DC-DC Converters
2. Features
(1) N-channel MOSFET and a schottky barrier diode in one package.
2.1. MOSFET Features
(1) Low drain-source on-resistance
: RDS(ON) = 160 mΩ (typ.) (@VGS = 3.6 V)
(2) 1.8-V gate drive voltage.
2.2. Diode Features
(1) Low forward voltage: VF = 0.51 V (typ.) (@IF = 500 mA)
3. Packaging and Internal Circuit
SSM6H19NU
1.Anode
2.NC
3.Drain
4.Source
5.Gate
6.Cathode
UDFN6
4. Absolute Maximum Ratings (Note)
4.1. Absolute Maximum Ratings of the MOSFET
(Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Rating
Unit
Drain-source voltage
Gate-source voltage
Drain current
(Note 1)
Drain current (pulsed)
(Note 1)
Channel temperature
Note 1: Ensure that the channel temperature does not exceed 150 .
VDSS
VGSS
ID
IDP
Tch
40
V
±12
2.0
A
4.0
150

Start of commercial production
2013-12
1
2014-03-12
Rev.2.0