CMC02 Datasheet, PDF (1/5 Pages) Toshiba Semiconductor – For Strobe Discharge Circuit

TOSHIBA RECTIFIER SILICON DIFFUSED TYPE
CMC02
CMC02
For Strobe Discharge Circuit
• Repetitive peak reverse voltage: V_RRM = 400 V
• Average forward current: I_{F (AV)} = 1.0 A
• Low forward voltage: V_FM = 1.0 V (max.)
• Repetitive peak forward current: I_FRM = 150 A (Note 2)
• Small surface-mount
package, the “M−FLAT^TM” (Toshiba package name)
Unit: mm
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Repetitive peak reverse voltage
V_RRM
400
V
Average forward current
I_{F (AV)}
1.0 (Note 1)
A
Peak one-cycle surge forward current
(non-repetitive)
I_FSM
30 (50 Hz)
A
Repetitive peak forward current
(Note 2)
I_FRM
150
A
Junction temperature
T_j
−40~150
°C
Storage temperature range
T_stg
−40~150
°C
JEDEC
―
Note 1: Ta＝92°C
Device mounted on a ceramic board
JEITA
―
Board size: 50 mm × 50 mm
TOSHIBA
3-4E1A
Soldering land: 2 mm ×2 mm
Board thickness: 0.64t
Weight: 0.023 g (typ.)
Note 3: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristic
Peak forward voltage
Peak repetitive reverse current
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to lead)
Symbol
V_{FM (1)}
I_RRM
R_{th (j-a)}
R_{th (j-ℓ)}
Test Condition
I_FM = 1.0 A (pulse test)
V_RRM = 400 V (pulse test)
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 t)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 t)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 2.1 mm × 1.4 mm)
(board thickness: 1.6 t)
⎯
Min Typ. Max Unit
⎯ 0.88 1.0
V
⎯
⎯
10
μA
⎯
⎯
60
⎯
⎯
110 °C/W
⎯
⎯
180
⎯
⎯
16 °C/W
1
2006-11-06