CMC01_06 Datasheet, PDF (1/5 Pages) Toshiba Semiconductor – SILICON DIFFUSED TYPE For Strobe Discharge Circuit

TOSHIBA RECTIFIER SILICON DIFFUSED TYPE
CMC01
CMC01
For Strobe Discharge Circuit
Unit: mm
• Repetitive peak reverse voltage
• : VRRM = 400 V
• Average forward current: IF (AV) = 1.0 A
• Repetitive peak forward current: IFRM = 150 A (Refer to the Note 2)
Small surface-mount package
“M−FLAT^TM” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
V_RRM
400
V
Average forward current (Note 1)
I_{F (AV)}
1.0(Ta=47°C)
A
Peak one cycle surge forward current
(non-repetitive)
I_FSM
30 (50 Hz)
A
Repetitive peak forward current
(Note 2)
I_FRM
150
A
Junction temperature
Storage temperature range
T_j
-40～150
°C
T_stg
-40～150
°C
Note 1: Device mounted on a glass-epoxy board
board size: 50 mm × 50 mm
JEDEC
JEITA
TOSHIBA
―
―
3-4E1A
soldering land: 6 mm ×6 mm
glass-epoxy board thickness 1.6t
Weight: 0.023 g (typ.)
Note 3: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Thermal resistance
Symbol
V_FM
I_RRM
R_{th (j-a)}
R_{th (j-ℓ)}
Test Condition
I_FM = 1.0 A （Pulse test）
V_RRM = 400 V （Pulse test）
Device mounted on a ceramic board
Board size: 50 mm × 50 mm
Soldering land: 2 mm × 2 mm
Ceramic board thickness: 0.64t
Device mounted on a glass-epoxy
board
Board size: 50 mm × 50 mm
Soldering land: 6 mm × 6 mm
glass-epoxy board thickness: 1.6t
Device mounted on a glass-epoxy
board
Board size: 50 mm × 50 mm
Soldering land: 2.1 mm × 1.4 mm
glass-epoxy board thickness: 1.6t
―
Min Typ. Max Unit
⎯ 0.86 1.0
V
⎯
⎯
10
μA
⎯
⎯
60
⎯
⎯
110 _°C/W
⎯
⎯
180
⎯
⎯
16 °C/W
1
2006-11-06