XC6215B282NR Datasheet, PDF (35/36 Pages) Torex Semiconductor – 0.8μA Low Power Consumption Voltage Regulator with ON/OFF Switch

● USPN-4 Power Dissipation
Power dissipation data for the USPN-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described
condition.
XC6215
Series
1.Measurement Condition (Reference data)
Condition:
Mount on a board
Ambient:
Natural convection
Soldering:
Board:
Lead (Pb) free
Dimensions 40 x 40 mm (1600 mm² in one side)
Copper (Cu) traces occupy 50% of the front and 50%
of the back.
The copper area is divided into four block,
one block is 12.5% of total.
The USPN-4 package has for terminals.
Each terminal connects one copper block in the front and
one in the back.
Material:
Glass Epoxy (FR-4)
Thickness:
1.6 mm
Through-hole:
4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃） Power Dissipation Pd（mW）
25
600
85
240
Thermal Resistance (℃/W)
166.67
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