XC6215B282NR Datasheet, PDF (34/36 Pages) Torex Semiconductor – 0.8μA Low Power Consumption Voltage Regulator with ON/OFF Switch

XC6215 Series
● USP-4 Power Dissipation
Power dissipation data for the USP-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described
40.0
condition.
28.9
1. Measurement Condition (Reference data)
Condition:
Mount on a board
Ambient:
Natural convection
Soldering:
Board:
Lead (Pb) free
Dimensions 40 x 40 mm (1600 mm² in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material:
Glass Epoxy (FR-4)
Thickness:
1.6 mm
Through-hole: 4 x 0.8 Diameter
2.54
1.4
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃） Power Dissipation Pd（mW）
25
1000
85
400
Thermal Resistance (℃/W)
100.00
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