XC6416 Datasheet, PDF (29/30 Pages) Torex Semiconductor – Dual LDO Voltage Regulator with “GreenOperation”

˙PACKAGING INFORMATION (Continued)
˔ç USP-6C Power Dissipation
Power dissipation data for the USP-6C is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
XC6416
Series
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm² in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Operating temperature
Board Mount (Tj max = 125ˆ)
Ambient Temperatureʢˆʣ Power Dissipation PdʢmWʣ Thermal Resistance (ˆ/W)
25
1000
100
85
400








1E
WT
5B





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