XC6503 Datasheet, PDF (22/26 Pages) Torex Semiconductor – CL Capacitor-Less 500mA Low Power Consumption High Speed LDO Regulator

XC6503 Series
■PACKAGING INFORMATION (Continued)
● SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition:
Mount on a board
Ambient:
Natural convection
Soldering:
Board:
Lead (Pb) free
Dimensions 40 x 40 mm (1600 mm² in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
Material:
Glass Epoxy (FR-4)
Thickness:
1.6 mm
Through-hole:
4 x 0.8 Diameter
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）
25
85
Power Dissipation Pd（mW）
600
240
評Eva価lua基tio板n Bレoaイrdア(Uウnit:トm（m単) 位：mm）
Thermal Resistance (℃/W)
166.67
700
600
500
400
300
200
100
0
25
Pd-T_Pa_d特_vs性_{. Ta}グラフ
45
65
85
105
125
Ambien周t T辺em温pe度ratuTrae:（T℃a (）℃)
22/26