XC6503 Datasheet, PDF (21/26 Pages) Torex Semiconductor – CL Capacitor-Less 500mA Low Power Consumption High Speed LDO Regulator

■PACKAGING INFORMATION (Continued)
● USP-4 Power Dissipation
Power dissipation data for the USP-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition:
Mount on a board
Ambient:
Natural convection
Soldering:
Board:
Lead (Pb) free
Dimensions 40 x 40 mm (1600 mm² in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material:
Glass Epoxy (FR-4)
Thickness:
1.6 mm
Through-hole:
4 x 0.8 Diameter
XC6503
Series
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）
25
85
Power Dissipation Pd（mW）
1000
400
Ev^Ea^vlu^aa^lt^uio^an^tiB^ooⁿa^Brd^o(^aU^rn^dit:⁽m^Umⁿⁱ)^t：mm)
Thermal Resistance (℃/W)
100.00
1200
1000
800
600
400
200
0
25
Pd Vs. Ta
45
65
85
105
125
AAmmbibeinetnTtemTpeemrapteurrea:tTuare(℃Ta): （℃）
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