XP162A11C0PR Datasheet, PDF (2/4 Pages) Torex Semiconductor – Power MOS FET

˙Electrical Characteristics
DC characteristics
PARAMETER
Drain Cut-off Current
Gate-Source Leakage Current
Gate-Source Cut-off Voltage
Drain-Source On-state Resistance
( note )
Forward Transfer Admittance
( note )
Body Drain Diode
Forward Voltage
SYMBOL
Idss
Igss
Vgs (off )
Rds ( on )
| Yfs |
Vf
( note ) : Effective during pulse test.
CONDITIONS
Vds = - 30 , Vgs = 0V
Vgs = ± 20 , Vds = 0V
Id = -1mA , Vds = - 10V
Id = - 1.5A , Vgs = - 10V
Id = - 1.5A , Vgs = - 4.5V
Id = - 1.5A , Vds = - 10V
If = - 2.5A , Vgs = 0V
Ta=25 ° C
MIN TYP M A X UNITS
- 10
µA
± 10
µA
- 1.0
- 2.5
V
0.11 0.15
Ω
0.2
0.28
Ω
2.5
S
- 0.85 - 1.1
V
Dynamic characteristics
Ta=25 ° C
PARAMETER
SYMBOL
CONDITIONS
MIN TYP M A X UNITS
Input Capacitance
Ciss
280
pF
Output Capacitance
Coss
Vds = - 10V , Vgs = 0V
200
pF
u
Feedback Capacitance
Crss
f = 1 MHz
90
pF
Switching characteristics
PARAMETER
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
SYMBOL
td ( on )
tr
td ( off )
tf
CONDITIONS
Vgs = - 5V , Id = - 1.5A
Vdd = - 10V
Ta=25 ° C
MIN TYP M A X UNITS
10
ns
30
ns
20
ns
35
ns
Thermal characteristics
PARAMETER
Thermal Resistance
( channel - surroundings )
SYMBOL
Rth ( ch - a )
CONDITIONS
Implement on a ceramic
PCB
MIN TYP M A X UNITS
62.5
°C / W