ADS5444-SP_15 Datasheet, PDF (9/22 Pages) Texas Instruments – CLASS V, 13 BIT, 250 MSPS ANALOG-TO-DIGITAL CONVERTER

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ADS5444-SP
SGLS391C – MARCH 2008 – REVISED JANUARY 2014
TERMINAL FUNCTIONS (continued)
TERMINAL
NAME
NO.
D7–D11, D7–D11
71–80
D12, D12
81, 82
DRY, DRY
83, 84
NC
5, 6, 31, 35, 46–51
DESCRIPTION
LVDS digital output pairs
LVDS digital output pair, most-significant bit (MSB)
Data ready LVDS output pair
No connect
THERMAL CHARACTERISTICS
PARAMETER
R_θJA
R_θJC
Junction-to-free-air thermal resistance
Junction-to-case thermal resistance
TEST CONDITIONS
Board mounted, per JESD 51-5 methodology
MIL-STD-883 Test Method 1012
TYP
21.813
0.849
UNIT
°C/W
°C/W
THERMAL NOTES
This CQFP package has built in vias that electrically and thermally connect the bottom of the die to a pad on the
bottom of the package. To efficiently remove heat and provide a low-impedance ground path, a thermal land is
required on the surface of the PCB directly underneath the body of the package. During normal surface mount
flow solder operations, the heat pad on the underside of the package is soldered to this thermal land creating an
efficient thermal path. Normally, the PCB thermal land has a number of thermal vias within it that provide a
thermal path to internal copper areas (or to the opposite side of the PCB) that provide for more efficient heat
removal. TI typically recommends an 11,9-mm² board-mount thermal pad. This allows maximum area for thermal
dissipation, while keeping leads away from the pad area to prevent solder bridging. A sufficient quantity of
thermal/electrical vias must be included to keep the device within recommended operating conditions. This pad
must be electrically at ground potential.
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