LP2953QML Datasheet, PDF (8/24 Pages) Texas Instruments – Adjustable Micropower Low-Dropout Voltage Regulators

DC Drift Parameters
The following conditions apply, unless otherwise specified. V_I = 6V, I_L = 1mA, C_L = 2.2µF, V_O = 5V
Feedback pin is tied to 5V Tap pin. Output pin is tied to Output Sense Pin.
Δcalculations performed on QMLV devices at group B , subgroup 5.
Symbol
Parameter
Conditions
Notes Min Max
V_I - V_O
I_Gnd
I_Gnd
I_Gnd
V_IO
I_IB
Dropout Voltage
Ground Pin Current
Ground Pin Current at
Dropout
Ground Pin Current at
Shutdown
Input Offset Voltage
Input Bias Current
I_L = 1mA
I_L = 50mA
I_L = 100mA
I_L = 250mA
I_L = 1mA, ±5µA or ±10% whichever is
greater
I_L = 50mA, ±5µA or ±10% whichever is
greater
I_L = 100mA, ±5µA or ±10% whichever is
greater
I_L = 250mA, ±5µA or ±10% whichever is
greater
V_I = 4.5V, I_L = 100µA,
±5µA or ±10% whichever is greater
±5µA or ±10% whichever is greater
Referred to V_Ref Shutdown Input
Referred to V_Ref Auxillary Comparator
V_I Comp = 0 to 5V Shutdown Input
V_I Comp = 0 to 5V Auxillary Comparator
-12 12
-12 12
-12 12
-12 12
-5.0 5.0
-5.0 5.0
-5.0 5.0
-5.0 5.0
-5.0 5.0
-5.0 5.0
-1.0 1.0
-1.0 1.0
-5.0 5.0
-5.0 5.0
Units
%
%
%
%
µA
µA
µA
µA
µA
µA
mV
mV
nA
nA
Sub-
groups
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Note 2: Abs. Max Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for which the device is functional,
but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see Electrical Characteristics. The guarantees apply only for
the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T_Jmax (maximum junction temperature), θ_JA (package
junction to ambient thermal resistance), and T_A (ambient temperature). The maximum allowable power dissipation at any temperature is P_Dmax = (T_Jmax - T_A)/
θ_JA or the number given in the Absolute Maximum Ratings, whichever is lower.
Note 4: The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full advantage of this
improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through,
the printed circuit board. Without this additional heat sinking, device power dissipation must be calculated using θ_JA, rather than θ_JC, thermal resistance. It must
not be assumed that the device leads will provide substantial heat transfer out the package, since the thermal resistance of the leadframe material is very poor,
relative to the material of the package base. The stated θ_JC thermal resistance is for the package material only, and does not account for the additional thermal
resistance between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and must combine
this with the stated value for the package, to calculate the total allowed power dissipation for the device.
Note 5: When used in dual-supply systems where the regulator load is returned to a negative supply, the output voltage must be diode-clamped to ground.
Note 6: May exceed the input supply voltage.
Note 7: Human body model, 1.5 KΩ in series with 100 pF.
Note 8: Dropout voltage is defined as the input to output differential at which the output voltage drops 100 mV below the value measured with a 1V differential.
At very low values of programmed output voltage, the input voltage minimum of 2V (2.3V over temperature) must be observed.
Note 9: Ground pin current is the regulator quiescent current. The total current drawn from the source is the sum of the ground pin current, output load current,
and current through the external resistive divider (if used).
Note 10: Thermal regulation is the change in output voltage at a time T after a change in power dissipation, excluding load or line regulation effects. Specifications
are for a 200 mA load pulse at V_I = V_O(Nom)+15V (3W pulse) for T = 10 mS.
Note 11: V_Ref ≤ V_O ≤ (V_I − 1V), 2.3V ≤ V_I ≤ 30V, 100 μA ≤ I_L ≤ 250 mA.
≤ Note 12: V_Shutdown 1.1V, V_O = V_O(Nom).
Note 13: Comparator thresholds are expressed in terms of a voltage differential at the Feedback terminal below the nominal V_Ref measured at V_I = V_O(Nom) +
1V. To express these thresholds in terms of output voltage change, multiply by the Error amplifier gain, which is V_O/ V_Ref = (R1 + R2)/R2 (refer to Figure 2).
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