CD40174B_15 Datasheet, PDF (8/16 Pages) Texas Instruments – CMOS HEX D-type Flip-Flop

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PACKAGE MATERIALS INFORMATION
14-Jul-2012
*All dimensions are nominal
Device
CD40174BM96
CD40174BNSR
Package Type
SOIC
SO
Package Drawing Pins
D
16
NS
16
SPQ
2500
2000
Length (mm)
333.2
367.0
Width (mm)
345.9
367.0
Height (mm)
28.6
38.0
Pack Materials-Page 2