CD40174B_15 Datasheet, PDF (5/16 Pages) Texas Instruments – CMOS HEX D-type Flip-Flop

PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2014
PACKAGING INFORMATION
Orderable Device
CD40174BE
CD40174BEE4
CD40174BF
Status Package Type Package Pins Package
(1)
Drawing
Qty
ACTIVE
PDIP
N
16
25
ACTIVE
PDIP
N
16
25
ACTIVE
CDIP
J
16
1
Eco Plan
(2)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
TBD
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
A42
MSL Peak Temp
(3)
N / A for Pkg Type
Op Temp (°C)
-55 to 125
N / A for Pkg Type -55 to 125
N / A for Pkg Type -55 to 125
CD40174BF3A
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type -55 to 125
CD40174BM
CD40174BM96
CD40174BNSR
CD40174BPW
CD40174BPWE4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SO
TSSOP
TSSOP
D
16
40 Green (RoHS
& no Sb/Br)
D
16 2500 Green (RoHS
& no Sb/Br)
NS 16 2000 Green (RoHS
& no Sb/Br)
PW
16
90 Green (RoHS
& no Sb/Br)
PW
16
90 Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
CD40174BE
CD40174BE
CD40174BF
CD40174BF3A
CD40174BM
CD40174BM
CD40174B
CM0174B
CM0174B
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Addendum-Page 1
Samples