OPA376-Q1_016 Datasheet, PDF (7/39 Pages) Texas Instruments – Low-Noise, Low Quiescent Current, Precision Operational Amplifier e-trim Series

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OPA376-Q1, OPA2376-Q1, OPA4376-Q1
SBOS549B – APRIL 2011 – REVISED JUNE 2016
6.4 Thermal Information: OPA376-Q1
THERMAL METRIC⁽¹⁾
OPA376-Q1
DCK (SC70) DBV (SOT-23)
D (SOIC)
UNIT
5 PINS
5 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
267
273.8
100.1
°C/W
80.9
126.8
42.4
°C/W
54.8
85.9
41
°C/W
1.2
10.9
4.8
°C/W
54.1
84.9
40.3
°C/W
n/a
n/a
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Thermal Information: OPA2376-Q1
THERMAL METRIC⁽¹⁾
OPA2376-Q1
D (SOIC)
DGK (VSSOP)
UNIT
8 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
111.1
54.7
51.7
10.5
51.2
n/a
171.2
63.9
92.8
9.2
91.2
n/a
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.6 Thermal Information: OPA4376-Q1
THERMAL METRIC⁽¹⁾
OPA4376-Q1
PW (TSSOP)
UNIT
14 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
107.8
29.6
52.6
1.5
51.6
n/a
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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