OPA317-Q1 Datasheet, PDF (7/29 Pages) Texas Instruments – Zero-Drift, Low-Offset, Rail-to-Rail I/O Operational Amplifier

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OPA317-Q1, OPA2317-Q1, OPA4317-Q1
SLOS914 – JULY 2016
6.4 Thermal Information: OPA317-Q1
THERMAL METRIC⁽¹⁾
OPA317-Q1
DBV (SOT-23)
UNIT
5 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
220.8
97.5
61.7
7.6
61.1
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Thermal Information: OPA2317-Q1
THERMAL METRIC⁽¹⁾
OPA2317-Q1
DGK (VSSOP)
UNIT
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
180.3
48.1
100.9
2.4
99.3
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.6 Thermal Information: OPA4317-Q1
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
THERMAL METRIC⁽¹⁾
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
OPA4317-Q1
PW (TSSOP)
14 PINS
120.8
34.3
62.8
1
56.5
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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