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MSP430G2553-Q1_15 Datasheet, PDF (61/71 Pages) Texas Instruments – Automotive Mixed-Signal Microcontrollers
www.ti.com
MSP430G2553-Q1, MSP430G2453-Q1
SLAS966 – MARCH 2014
MSP 430 F 5 438 A I ZQW T XX
Processor Family
Optional: Additional Features
430 MCU Platform
Optional: Tape and Reel
Device Type
Packaging
Series
Feature Set
Optional: Temperature Range
Optional: A = Revision
Processor Family
430 MCU Platform
Device Type
Series
CC = Embedded RF Radio
MSP = Mixed Signal Processor
XMS = Experimental Silicon
PMS = Prototype Device
TI’s Low Power Microcontroller Platform
Memory Type
C = ROM
F = Flash
FR = FRAM
G = Flash or FRAM (Value Line)
L = No Nonvolatile Memory
Specialized Application
AFE = Analog Front End
BT = Preprogrammed with Bluetooth
BQ = Contactless Power
CG = ROM Medical
FE = Flash Energy Meter
FG = Flash Medical
FW = Flash Electronic Flow Meter
1 Series = Up to 8 MHz
2 Series = Up to 16 MHz
3 Series = Legacy
4 Series = Up to 16 MHz w/ LCD
5 Series = Up to 25 MHz
6 Series = Up to 25 MHz w/ LCD
0 = Low Voltage Series
Feature Set
Various Levels of Integration Within a Series
Optional: A = Revision
Optional: Temperature Range
Packaging
N/A
S = 0°C to 50°C
C = 0°C to 70°C
I = -40°C to 85°C
T = -40°C to 105°C
www.ti.com/packaging
Optional: Tape and Reel
T = Small Reel (7 inch)
R = Large Reel (11 inch)
No Markings = Tube or Tray
Optional: Additional Features -EP = Enhanced Product (-40°C to 105°C)
-HT = Extreme Temperature Parts (-55°C to 150°C)
-Q1 = Automotive Q100 Qualified
Figure 25. Device Nomenclature
Copyright © 2014, Texas Instruments Incorporated
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Product Folder Links: MSP430G2553-Q1 MSP430G2453-Q1