UC1846-SP_15 Datasheet, PDF (6/29 Pages) Texas Instruments – Current-Mode PWM Controller

UC1846-SP
SLUS871C – JANUARY 2009 – REVISED OCTOBER 2015
6 Specifications
www.ti.com
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾
MIN
V_CC
Supply voltage
Collector supply voltage
V_I
Analog input voltage (C/S-, C/S+, E/A+, E/A-, Shutdown)
–0.3
I_O
Output current, source or sink
Reference output current
Sync output current
Error amplifier output current
Soft-start sink current
Oscillator charging current
T_J(max)
Maximum junction temperature
T_lead
Lead temperature (soldering, 10 s)
T_stg
Storage temperature
–65
MAX
40
40
V_IN
500
–30
–5
–5
50
5
150
300
150
UNIT
V
V
V
mA
mA
mA
mA
mA
mA
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground. Currents are positive into, negative out of the specified terminal.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
VALUE
±2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
T_J
Operating junction temperature
MIN
NOM
MAX UNIT
–55
125
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
J (CDIP)
UC1846-SP
W (CFP)
FK (LCCC)
UNIT
16 PINS
16 PINS
20 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
104.2
N/A
36.6
25.0
27.9
8.2
105.2
N/A
96.8
24.0
82.6
8.5
N/A
°C/W
N/A
°C/W
N/A
°C/W
N/A
°C/W
N/A
°C/W
9.0
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6
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