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U5B7741393 Datasheet, PDF (6/11 Pages) Texas Instruments – LM741 Operational Amplifier
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
LM741CH
LM741CH/NOPB
LM741CN
LM741CN/NOPB
LM741H
LM741H/NOPB
LM741J
U5B7741312
U5B7741393
U9T7741393
Status Package Type Package Pins Package
(1)
Drawing
Qty
ACTIVE
TO-99
LMC
8
500
Eco Plan
(2)
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp
(3)
Call TI
Op Temp (°C)
0 to 70
ACTIVE
ACTIVE
TO-99
PDIP
LMC
8
500 Green (RoHS POST-PLATE Level-1-NA-UNLIM
& no Sb/Br)
P
8
40
TBD
Call TI
Call TI
0 to 70
0 to 70
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
TO-99
TO-99
CDIP
TO-99
TO-99
PDIP
P
8
40 Green (RoHS
& no Sb/Br)
LMC
8
500
TBD
SN
Call TI
Level-1-NA-UNLIM
Call TI
0 to 70
-55 to 125
LMC
8
500 Green (RoHS POST-PLATE Level-1-NA-UNLIM -55 to 125
& no Sb/Br)
NAB 8
40
TBD
Call TI
Call TI
-55 to 125
LMC
8
500
TBD
Call TI
Call TI
-55 to 125
LMC
8
500
TBD
Call TI
Call TI
0 to 70
P
8
40
TBD
Call TI
Call TI
0 to 70
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Top-Side Markings
(4)
LM741CH
LM741CH
LM
741CN
LM
741CN
LM741H
LM741H
LM741J
LM741H
LM741CH
LM
741CN
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Samples
Addendum-Page 1