OPA377-Q1_16 Datasheet, PDF (6/31 Pages) Texas Instruments – Low-Noise, Low Quiescent Current, Precision Automotive Grade Operational Precision Automotive Grade Operational

OPA377-Q1, OPA2377-Q1, OPA4377-Q1
SBOS797A – MAY 2016 – REVISED MAY 2016
6 Specifications
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6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_S = (V+) – (V–)
T_A
T_J
T_stg
Supply voltage
Signal input terminal voltage⁽²⁾
Signal input terminal current⁽²⁾
Output short-circuit current⁽³⁾
Operating temperature
Junction temperature
Storage temperature
MIN
(V–) – 0.5
–10
–40
–65
MAX
7
(V+) + 0.5
10
Continuous
150
150
150
UNIT
V
V
mA
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should
be current limited to 10 mA or less.
(3) Short-circuit to ground, one amplifier per package.
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
VALUE
±4000
±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage
T_A
Operating temperature
MIN
MAX
UNIT
2.2
5.5
V
–40
150
°C
6.4 Thermal Information: OPA377-Q1
THERMAL METRIC⁽¹⁾
OPA377-Q1
DBV (SOT23)
UNIT
5 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
273.8
126.8
85.9
10.9
84.9
n/a
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Thermal Information: OPA2377-Q1
THERMAL METRIC⁽¹⁾
R_θJA
R_θJC(top)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
OPA2377-Q1
DGK (VSSOP)
8 PINS
171.2
63.9
UNIT
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6
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