OPA348-Q1_16 Datasheet, PDF (6/32 Pages) Texas Instruments – CMOS Rail-to-Rail Operational Amplifier

OPA348-Q1, OPA2348-Q1, OPA4348-Q1
SBOS465C – JANUARY 2009 – REVISED JANUARY 2016
www.ti.com
6.4 Thermal Information: OPA348-Q1
THERMAL METRIC⁽¹⁾
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_{θJC(bottom)}
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
OPA348-Q1
DBV (SOT-23)
D (SOIC)
5 PINS
8 PINS
228.5
142.0
99.1
90.2
54.6
82.5
7.7
39.4
53.8
82.0
n/a
n/a
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Thermal Information: OPA2348-Q1, OPA4348-Q1
THERMAL METRIC⁽¹⁾
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_{θJC(bottom)}
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
OPA2348-Q1
D (SOIC)
8 PINS
138.4
89.5
78.6
29.9
78.1
n/a
OPA4348-Q1
PW (TSSOP)
14 PINS
121
49.4
62.8
5.9
62.2
n/a
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6
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