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OPA1678 Datasheet, PDF (6/41 Pages) Texas Instruments – Low-Distortion Audio Operational Amplifiers
OPA1678, OPA1679
SBOS855 – FEBRUARY 2017
www.ti.com
6.4 Thermal Information: OPA1678
THERMAL METRIC(1)
OPA1678
D (SOIC)
DGK (VSSOP)
UNIT
8 PINS
8 PINS
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
144
219
°C/W
77
79
°C/W
62
104
°C/W
28
15
°C/W
61
102
°C/W
N/A
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Thermal Information: OPA1679
THERMAL METRIC(1)
OPA1679
D (SOIC)
PW (TSSOP)
UNIT
14 PINS
14 PINS
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
90
127
°C/W
55
47
°C/W
44
59
°C/W
20
5.5
°C/W
44
58
°C/W
N/A
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6
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