OPA1678 Datasheet, PDF (28/41 Pages) Texas Instruments – Low-Distortion Audio Operational Amplifiers

OPA1678, OPA1679
SBOS855 – FEBRUARY 2017
10.2 Layout Example
VIN A
RG
Place components
close to device and to
each other to reduce
parasitic errors.
Output A
+
RF
VIN B
VOUT A
RG
(Schematic Representation)
+
RF
RF
GND
RG
VIN A
OUTPUT A
-IN A
+IN A
V±
V+
OUTPUT B
-IN B
+IN B
VOUT B
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VS+
RF
RG
Use low-ESR,
ceramic bypass
capacitor. Place as
close to the device
as possible.
GND
Output B
GND
VIN B
Use low-ESR,
ceramic bypass
capacitor. Place as
close to the device
as possible.
GND
VS±
Ground (GND) plane on another layer
Keep input traces short
and run the input traces
as far away from
the supply lines
as possible.
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Figure 42. Operational Amplifier Board Layout for Noninverting Configuration
10.3 Power Dissipation
The OPA167x series op amps are capable of driving 2-kΩ loads with a power-supply voltage up to ±18 V and full
operating temperature range. Internal power dissipation increases when operating at high supply voltages.
Copper leadframe construction used in the OPA167x series op amps improves heat dissipation compared to
conventional materials. Circuit board layout can also help minimize junction temperature rise. Wide copper traces
help dissipate the heat by acting as an additional heat sink. Temperature rise can be further minimized by
soldering the devices to the circuit board rather than using a socket.
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