OPA140 Datasheet, PDF (6/44 Pages) Texas Instruments – 11-MHz JFET Op Amp

OPA140, OPA2140, OPA4140
SBOS498B – JULY 2010 – REVISED NOVEMBER 2015
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6.4 Thermal Information: OPA140
THERMAL METRIC⁽¹⁾
D (SOIC)
OPA140
DBV (SOT) DGK (VSSOP)
UNIT
8 PINS
5 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
160
210
180
°C/W
75
200
55
°C/W
60
110
130
°C/W
9
40
N/A
°C/W
50
105
120
°C/W
N/A
N/A
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
6.5 Thermal Information: OPA2140
THERMAL METRIC⁽¹⁾
OPA2140
D (SOIC)
DGK (VSSOP)
UNIT
8 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
160
180
°C/W
75
55
°C/W
60
130
°C/W
9
N/A
°C/W
50
120
°C/W
N/A
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
6.6 Thermal Information: OPA4140
THERMAL METRIC⁽¹⁾
OPA4140
D (SOIC)
PW (TSSOP)
UNIT
14 PINS
14 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
97
135
°C/W
56
45
°C/W
53
66
°C/W
19
N/A
°C/W
46
60
°C/W
N/A
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
6
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