LP8728-Q1 Datasheet, PDF (6/18 Pages) Texas Instruments – LP8728-Q1 Quad-Output Step-Down DC/DC Converter

LP8728-Q1
SNVS972 – AUGUST 2013
PIN #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
PIN NAME
EN_B1
VIN_B1
SW_B1
GND_B1
GND_B2
SW_B2
VIN_B2
FB_B2
EN_B2
PG_B2
DEFSEL
PG_B3
EN_B3
FB_B3
VIN_B3
SW_B3
GND_B3
GND_B4
SW_B4
VIN_B4
EN_B4
FB_B4
PG_B4
AGND
BYP
26
27
28
DAP
AVDD
PG_B1
FB_B1
Die Attachment
Pad
TYPE
D/I
P
P
G
G
P
P
A
D/I
D/O
D/I
D/O
D/I
A
P
P
G
G
P
P
D/I
A
D/O
G
A
P
D/O
A
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Table 1. PIN DESCRIPTIONS
DESCRIPTION
Enable buck 1
Positive power supply input for Buck 1
Switch node for Buck 1
Power ground for Buck 1
Power ground for Buck 2
Switch node for Buck 2
Positive power supply input for Buck 2
Feedback pin for Buck 2. Referenced against AGND.
Enable Buck 2
Open-drain Power Good output for Buck 2
Buck 3 output voltage selection pin
Open-drain Power Good output for Buck 3
Enable buck 3
Feedback pin for Buck 3. Referenced against AGND.
Positive power supply input for Buck 3
Switch node for Buck 3
Power ground for Buck 3
Power ground for Buck 4
Switch node for Buck 4
Positive power supply input for Buck 4
Enable Buck 4
Feedback pin for Buck 4. Referenced against AGND.
Open-drain Power Good output for Buck 4
Analog ground
Internal 1.8V supply voltage capacitor pin. A ceramic low ESR 1.0 μF capacitor should be
connected from this pin to AGND. The BYP voltage is generated internally, do not supply or
load this pin externally.
Analog positive power supply pin (VIN level)
Open-drain Power Good output for Buck 1
Feedback pin for Buck 1. Referenced against AGND.
Exposed die attachment pad should to be connected to GND plane with thermal vias to
improve the thermal performance of the system.
6
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