|
BQ24133 Datasheet, PDF (6/35 Pages) Texas Instruments – 1.6-MHz Synchronous Switch-Mode Li-Ion and Li-Polymer Stand-Alone Battery Charger with Integrated MOSFETs and Power Path Selector | |||
|
◁ |
bq24133
SLUSAF7B â DECEMBER 2010 â REVISED MAY 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)(2)
VALUE
UNIT
AVCC, ACP, ACN, ACDRV, CMSRC, STAT
â0.3 to 30
PVCC
â0.3 to 20
BTST
â0.3 to 26
Voltage range (with respect to AGND)
BATDRV, SRP, SRN
SW
â0.3 to 20
V
â2 to 20
OVPSET, REGN, TS, TTC, CELL
â0.3 to 7
VREF, ISET, ACSET
â0.3 to 3.6
PGND
â0.3 to 0.3
Maximum difference voltage
SRPâSRN, ACP-ACN
â0.5 to 0.5
V
Junction temperature range, TJ
Storage temperature range, Tstg
â40 to 155
°C
â55 to 155
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging
Section of the data book for thermal limitations and considerations of packages.
THERMAL INFORMATION
THERMAL METRIC(1)
bq24133
RGY
UNITS
θJA
Junction-to-ambient thermal resistance(2)
ÏJT
Junction-to-top characterization parameter(3)
ÏJB
Junction-to-board characterization parameter(4)
24 PINS
35.7
0.4
31.2
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-top characterization parameter, ÏJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(4) The junction-to-board characterization parameter, ÏJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
RECOMMENDED OPERATING CONDITIONS
Input voltage
Output voltage
Output current (RSR 10mΩ)
Maximum difference voltage
VIN
VOUT
IOUT
ACP - ACN
SRPâSRN
Operation free-air temperature range, TA
MIN
4.5
0.6
â200
â200
â40
MAX
17
13.5
2.5
200
200
85
UNIT
V
V
A
mV
mV
°C
6
Submit Documentation Feedback
Product Folder Link(s): bq24133
Copyright © 2010â2011, Texas Instruments Incorporated
|
▷ |