TAS5760L Datasheet, PDF (59/77 Pages) Texas Instruments – Check for Samples: TAS5760L

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TAS5760L
SLOS782B – JULY 2013 – REVISED SEPTEMBER 2015
11 Power Supply Recommendations
The TAS5760L device requires two power supplies for proper operation. A high-voltage supply called PVDD is
required to power the output stage of the speaker amplifier and its associated circuitry. Additionally, one low
voltage power supply called DVDD is required to power the various low-power portions of the device. The
allowable voltage range for both the PVDD and the DVDD supply are listed in the Recommended Operating
Conditions table.
11.1 DVDD Supply
The DVDD supply required from the system is used to power several portions of the device it provides power to
the DVDD pin and the DRVDD pin. Proper connection, routing, and decoupling techniques are highlighted in the
TAS5760xx EVM User's Guide, SLOU371 (as well as the Application and Implementation section and Layout
Example section) and must be followed as closely as possible for proper operation and performance. Deviation
from the guidance offered in the TAS5760L device EVM User's Guide, which followed the same techniques as
those shown in the Application and Implementation section, may result in reduced performance, errant
functionality, or even damage to the TAS5760L device. Some portions of the device also require a separate
power supply which is a lower voltage than the DVDD supply. To simplify the power supply requirements for the
system, the TAS5760L device includes an integrated low-dropout (LDO) linear regulator to create this supply.
This linear regulator is internally connected to the DVDD supply and its output is presented on the ANA_REG
pin, providing a connection point for an external bypass capacitor. It is important to note that the linear regulator
integrated in the device has only been designed to support the current requirements of the internal circuitry, and
should not be used to power any additional external circuitry. Additional loading on this pin could cause the
voltage to sag, negatively affecting the performance and operation of the device.
11.2 PVDD Supply
The output stage of the speaker amplifier drives the load using the PVDD supply. This is the power supply which
provides the drive current to the load during playback. Proper connection, routing, and decoupling techniques are
highlighted in the TAS5760L device EVM and must be followed as closely as possible for proper operation and
performance. Due the high-voltage switching of the output stage, it is particularly important to properly decouple
the output power stages in the manner described in the TaS5760xx EVM User's Guide, SLOU371. The lack of
proper decoupling, like that shown in the EVM User's Guide, can results in voltage spikes which can damage the
device. A separate power supply is required to drive the gates of the MOSFETs used in the output stage of the
speaker amplifier. This power supply is derived from the PVDD supply via an integrated linear regulator. A
GVDD_REG pin is provided for the attachment of decoupling capacitor for the gate drive voltage regulator. It is
important to note that the linear regulator integrated in the device has only been designed to support the current
requirements of the internal circuitry, and should not be used to power any additional external circuitry. Additional
loading on this pin could cause the voltage to sag, negatively affecting the performance and operation of the
device.
12 Layout
12.1 Layout Guidelines
12.1.1 General Guidelines for Audio Amplifiers
Audio amplifiers which incorporate switching output stages must have special attention paid to their layout and
the layout of the supporting components used around them. The system level performance metrics, including
thermal performance, electromagnetic compliance (EMC), device reliability, and audio performance are all
affected by the device and supporting component layout. Ideally, the guidance provided in the applications
section with regard to device and component selection can be followed by precise adherence to the layout
guidance shown in Layout Example. These examples represent exemplary baseline balance of the engineering
trade-offs involved with laying out the device. These designs can be modified slightly as needed to meet the
needs of a given application. In some applications, for instance, solution size can be compromised in order to
improve thermal performance through the use of additional contiguous copper near the device. Conversely, EMI
performance can be prioritized over thermal performance by routing on internal traces and incorporating a via
picket-fence and additional filtering components. In all cases, it is recommended to start from the guidance
shown in the Layout Example section and the TAS5760xx EVM, and work with TI field application engineers or
through the E2E community in order to modify it based upon the application specific goals.
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