TMS320C54X_16 Datasheet, PDF (55/118 Pages) Texas Instruments – FIXED-POINT DIGITAL SIGNAL PROCESSORS

TMS320C54x, TMS320LC54x, TMS320VC54x
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS039C – FEBRUARY 1996 – REVISED DECEMBER 1999
device and development support tool nomenclature (continued)
TMS 320 (B) C 542 PGE (L)
PREFIX
TMX =
TMP =
TMS =
SMJ =
SM =
experimental device
prototype device
qualified device
MIL-STD-883C
High Rel (non-883C)
DEVICE FAMILY
320 = TMS320 Family
BOOT-LOADER OPTION
TECHNOLOGY
C=
E=
F=
LC =
VC =
CMOS
CMOS EPROM
CMOS Flash EEPROM
Low-Voltage CMOS (3.3 V)
Low Voltage CMOS [3 V (2.5 V core)]
TEMPERATURE RANGE
(’54x DEFAULT: –40°C TO 100°C)
H=
L=
S=
M=
A=
0°C to 50°C
0°C to 70°C
– 55°C to 100°C
– 55°C to 125°C
– 40°C to 85°C
PACKAGE TYPE†
N=
J=
JD =
GB =
FZ =
FN =
FD =
PJ =
PQ =
PZ =
PBK =
PGE =
GGU =
plastic DIP
ceramic DIP
ceramic DIP side-brazed
ceramic PGA
ceramic CC
plastic leaded CC
ceramic leadless CC
100-pin plastic EIAJ QFP
132-pin plastic bumpered QFP
100-pin plastic TQFP
128-pin plastic TQFP
144-pin plastic TQFP
144-pin BGA
† _{DIP = Dual-In-Line Package}
PGA = Pin Grid Array
CC = Chip Carrier
QFP = Quad Flat Package
TQFP = Thin Quad Flat Package
DEVICE
’1x DSP:
10 16
14 17
15
’2x DSP:
25
26
’2xx DSP:
203 206 240
204 209
’3x DSP:
30
31
32
’4x DSP:
40
44
’5x DSP:
50 53
51 56
52 57
’54x DSP:
541 545
542 546
543 548
549
’6x DSP:
6201
6701
Figure 10. TMS320 DSP Device Nomenclature
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