TPS24710_15 Datasheet, PDF (5/38 Pages) Texas Instruments – High-Efficiency Power-Limiting Hot-Swap Controller

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TPS24710, TPS24711
TPS24712, TPS24713
SLVSAL2G – JANUARY 2011 – REVISED NOVEMBER 2015
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range, all voltages referred to GND (unless otherwise noted) ⁽¹⁾
Input voltage
range
Sink current
Source current
Temperature
EN, FLT⁽²⁾⁽³⁾, FLTb⁽²⁾⁽⁴⁾, GATE, OUT, PG⁽²⁾⁽³⁾, PGb⁽²⁾⁽⁴⁾, SENSE, VCC
PROG ⁽²⁾
SENSE to VCC
TIMER
FLT, PG, FLTb, PGb
PROG
Maximum junction, T_J
MIN
MAX
–0.3
30
–0.3
3.6
–0.3
0.3
–0.3
5
5
Internally limited
Internally limited
UNIT
V
mA
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Do not apply voltages directly to these pins.
(3) for TPS24712/13
(4) for TPS24710/11
7.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS- All pins except PG
001 ⁽¹⁾
and PGb
PG, PGb
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±2000
±500
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
V
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Input voltage range
SENSE, VCC
EN, FLT, FLTb, PG, PGb, OUT
Sink current
FLT, FLTb, PG, PGb
Resistance
PROG
External capacitance
TIMER
Operating junction temperature range, T_J
MIN NOM MAX UNIT
2.5
18
V
0
18
0
2 mA
4.99
500 kΩ
1
nF
–40
125 °C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
TPS2471/x
MSOP (10) PINS
UNIT
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
166.5
41.8
86.1
1.5
84.7
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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