TLE2082AIDR Datasheet, PDF (5/79 Pages) Texas Instruments – EXCALIBUR HIGH-SPEED JFET-INPUT OPERATIONAL AMPLIFIERS

TLE208x, TLE208xA, TLE208xY
EXCALIBUR HIGH-SPEED JFET-INPUT
OPERATIONAL AMPLIFIERS
SLOS182B – FEBRUARY 1997 – REVISED JUNE 2001
TLE2082Y chip information
This chip, when properly assembled, displays characteristics similar to the TLE2082. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(8)
(1)
(7)
(3)
1IN +
(2)
1IN –
(7)
2OUT
VCC+
(8)
+
–
+
–
(4)
VCC_–
(1)
1OUT
(5)
2IN +
(6)
2IN –
90 (2)
(6)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
(3)
(4)
(5)
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF THE CHIP.
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