THS770012_14 Datasheet, PDF (5/36 Pages) Texas Instruments – Broadband, Fully-Differential, 14-/16-Bit ADC Driver Amplifier

THS770012
www.ti.com
SLOS669C – FEBRUARY 2010 – REVISED JANUARY 2012
ELECTRICAL CHARACTERISTICS (continued)
Test conditions are at T_A = +25°C, V_S+ = +5V, V_OCM = +2.5V, V_OUT = 2V_PP, R_L = 400Ω differential, G = +12dB, differential input
and output, and input and output referenced to midsupply, unless otherwise noted. Measured using evaluation module as
discussed in Test Circuits section.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TEST
LEVEL ⁽¹⁾
OUTPUT COMMON-MODE VOLTAGE CONTROL
V_OCM small-signal bandwidth
V_OCM slew rate
V_OCM voltage range
V_OCM gain
Output common-mode offset
from V_OCM input
V_OCM input bias current
POWER SUPPLY
V_{OUT_CM} = 200mV_PP
V_{OUT_CM} = 500mV step
Supplied by external source⁽²⁾
V_OCM = 2.5V
V_OCM = 2.5V
2.25V ≤ V_OCM ≤ 2.75V
300
MHz
C
150
V/µs
C
2.25
2.5
2.75
V
C
0.98
1
1.02 V/V
A
–30
±12
30 mV
A
–400
±30
400
µA
A
Specified operating voltage
4.75
5
5.25
V
C
Quiescent current
Power-supply rejection ratio
POWER-DOWN
T_A = +25°C
T_A = –40°C to +85°C
T_A = +25°C, V_S+ = 5V ±0.25V
T_A = –40°C to +85°C, V_S+ = 5V ±0.5V
85
100
115 mA
A
80
125 mA
B
60
90
dB
A
59
dB
B
Enable voltage threshold
Device powers on below 0.5V
0.5
V
A
Disable voltage threshold
Device powers down above 2.0V
2
V
A
Power-down quiescent current
0.8
3 mA
A
Input bias current
80
100
µA
A
Turn-on time delay
Time to V_OUT = 90% of final value
Turn-off time delay
Time to V_OUT = 10% of original value
THERMAL CHARACTERISTICS
10
µs
C
0.15
µs
C
Specified operating range
Thermal resistance, θ_JC(3)
Thermal resistance, θ_JA(3)
Junction to case (bottom)
Junction to ambient
–40
+85
°C
C
8.9
°C/W
C
44.1
°C/W
C
(2) Limits set by best harmonic distortion with V_OUT = 3V_PP. V_OCM voltage range can be extended if lower output swing is used or distortion
degradation is allowed, and increased bias current into pin is acceptable. For more information, see Figure 18 and Figure 34.
(3) Tested using JEDEC High-K test PCB. Thermal management of the final printed circuit board (PCB) should keep the junction
temperature below +125°C for long term reliability.
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