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THS4531A_16 Datasheet, PDF (5/59 Pages) Texas Instruments – Ultra Low-Power, Rail-to-Rail Output, Fully Differential Amplifier
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7 Specifications
THS4531A
SLOS823C – DECEMBER 2012 – REVISED JANUARY 2016
7.1 Absolute Maximum Ratings
Supply voltage, VS– to VS+
Input/output voltage, VIN±, VOUT±, and VOCM pins
Differential input voltage, VID
Continuous output current, IO
Continuous input current, Ii
Continuous power dissipation
Maximum junction temperature, TJ
Operating free-air temperature, TA
Storage temperature, Tstg
MIN
MAX
5.5
(VS–) – 0.7 (VS+) + 0.7
1
50
0.75
See Thermal Information
150
–40
125
–65
150
UNIT
V
V
mA
mA
°C
°C
°C
7.2 ESD Ratings
V(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-
C101 (2)
VALUE
±3000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VS+
Single-supply voltage
TA
Ambient temperature
MIN
NOM
MAX
2.7
5
5.4
–40
25
125
UNIT
V
UNIT
V
°C
7.4 Thermal Information
THERMAL METRIC(1)
D (SOIC)
THS4531A
DGK (VSSOP) RUN (WQFN)
UNIT
8 PINS
8 PINS
10 PINS
RθJA Junction-to-ambient thermal resistance
RθJC(top) Junction-to-case (top) thermal resistance
RθJB Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter
ψJB
Junction-to-board characterization parameter
RθJC(bot) Junction-to-case (bottom) thermal resistance
133
198
163
°C/W
78
84
66
°C/W
73
120
113
°C/W
26
19
17
°C/W
73
118
113
°C/W
N/A
N/A
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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