OPA1662 Datasheet, PDF (5/29 Pages) Texas Instruments – Low-Power, Low Noise and Distortion, Bipolar-Input AUDIO OPERATIONAL AMPLIFIERS

OPA1662
OPA1664
www.ti.com
SBOS489 – DECEMBER 2011
ELECTRICAL CHARACTERISTICS: V_S = +5 V (continued)
At T_A = +25°C and R_L = 2 kΩ, unless otherwise noted. V_CM = V_OUT = midsupply, unless otherwise noted.
OPA1662, OPA1664
PARAMETER
CONDITIONS
MIN
TYP
MAX
OPEN-LOOP GAIN
A_OL
Open-loop voltage gain
OUTPUT
(V–) + 0.6 V ≤ V_O ≤ (V+) – 0.6 V, R_L = 2 kΩ
90
100
V_OUT Output voltage
I_OUT
Output current
Z_O
Open-loop output impedance
I_SC
Short-circuit current⁽³⁾
C_LOAD Capacitive load drive
POWER SUPPLY
R_L = 2 kΩ
(V–) + 0.6
(V+) – 0.6
See Typical Characteristics
See Typical Characteristics
±40
200
V_S
Specified voltage range
I_Q
Quiescent current
(per channel)
TEMPERATURE
I_OUT = 0 A
I_OUT = 0 A, T_A = –40°C to +85°⁽²⁾
±1.5
±18
1.4
1.7
2
Specified range
–40
+85
Operating range
–55
+125
(3) One channel at a time.
UNIT
dB
V
mA
Ω
mA
pF
V
mA
mA
°C
°C
THERMAL INFORMATION: OPA1662
THERMAL METRIC⁽¹⁾
OPA1662
D (SO)
DGK (MSOP)
UNITS
8 PINS
8 PINS
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
156.3
85.5
64.9
33.8
64.3
N/A
225.4
78.8
110.5
14.6
108.5
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION:OPA1664
THERMAL METRIC⁽¹⁾
OPA1664
D (SO)
PW (TSSOP)
UNITS
14 PINS
14 PINS
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
78.6
125.8
37.0
45.2
24.9
57.5
°C/W
9.7
5.5
24.6
56.7
N/A
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2011, Texas Instruments Incorporated
5
Product Folder Link(s): OPA1662 OPA1664