OPA1652_16 Datasheet, PDF (5/42 Pages) Texas Instruments – Audio Operational Amplifiers

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OPA1652, OPA1654
SBOS477A – DECEMBER 2011 – REVISED AUGUST 2016
6.4 Thermal Information: OPA1652
THERMAL METRIC⁽¹⁾
OPA1652
D (SOIC)
DGK (VSSOP)
UNIT
8 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
143.6
76.9
61.8
27.8
61.3
N/A
218.9
78.6
103.7
14.6
101.8
N/A
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the application report, Semiconductor and IC Package Thermal
Metrics.
6.5 Thermal Information: OPA1654
THERMAL METRIC⁽¹⁾
OPA1654
D (SOIC)
PW (TSSOP)
UNIT
14 PINS
14 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
90.1
126.9
°C/W
54.8
46.6
°C/W
44.4
58.6
°C/W
19.9
5.5
°C/W
44.2
57.8
°C/W
N/A
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the application report, Semiconductor and IC Package Thermal
Metrics.
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