OPA1652_16 Datasheet, PDF (25/42 Pages) Texas Instruments – Audio Operational Amplifiers

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10.2 Layout Example
VIN A
RG
+
RF
OPA1652, OPA1654
SBOS477A – DECEMBER 2011 – REVISED AUGUST 2016
VIN B
VOUT A
RG
+
RF
VOUT B
Place components
close to device and to
each other to reduce
parasitic errors
GND
VIN A
Output A
Output A
RF
-In A
RG
+In A
V±
(Schematic Representation)
V+
Output B
-In B
+In B
VS+
RF
RG
Use low-ESR,
ceramic bypass
capacitor. Place as
close to the device
as possible
GND
Output B
GND
VIN B
Use low-ESR,
ceramic bypass
capacitor. Place as
close to the device
as possible
GND
VS±
Ground (GND) plane on another layer
Keep input traces short
and run the input traces
as far away from
the supply lines
as possible
Copyright © 2016, Texas Instruments Incorporated
Figure 47. Operational Amplifier Board Layout for Noninverting Configuration
10.3 Power Dissipation
The OPA1652 and OPA1654 series op amps are capable of driving 2-kΩ loads with a power-supply voltage up to
±18 V and full operating temperature range. Internal power dissipation increases when operating at high supply
voltages. Copper leadframe construction used in the OPA165x series op amps improves heat dissipation
compared to conventional materials. Circuit board layout can also help minimize junction temperature rise. Wide
copper traces help dissipate the heat by acting as an additional heat sink. Temperature rise can be further
minimized by soldering the devices to the circuit board rather than using a socket.
Copyright © 2011–2016, Texas Instruments Incorporated
Product Folder Links: OPA1652 OPA1654
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