LM3444_15 Datasheet, PDF (5/27 Pages) Texas Instruments – AC-DC Offline LED Driver

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LM3444
SNVS682D – NOVEMBER 2010 – REVISED DECEMBER 2015
6.5 Electrical Characteristics
All typical limits are for T_J = 25°C and all maximum and minimum limits apply over the full operating temperature range
(T_J = −40°C to 125°C). Minimum and maximum limits are specified through test, design, or statistical correlation. Typical
values represent the most likely parametric norm at T_J = 25°C, and are provided for reference purposes only. Unless
otherwise stated the following conditions apply: V_CC = 12 V.
PARAMETER
TEST CONDITIONS
MIN TYP MAX UNIT
V_CC SUPPLY
I_VCC
Operating supply current
Rising threshold
1.58 2.25 mA
7.4
7.7
V_CC-UVLO
Falling threshold
Hysterisis
6
6.4
V
1
COFF
V_COFF
Time-out threshold
R_COFF
Off timer sinking impedance
t_COFF
Restart timer
CURRENT LIMIT
1.225 1.276 1.327 V
33
60 Ω
180
µs
V_ISNS
ISNS limit threshold
Leading edge blanking time
1.174 1.269 1.364 V
125
ns
t_ISNS
Current limit reset delay
ISNS limit to GATE delay
ISNS = 0 to 1.75-V step
180
µs
33
ns
CURRENT SENSE COMPARATOR
V_FILTER
FILTER open circuit voltage
R_FILTER
FILTER impedance
V_OS
Current sense comparator offset voltage
GATE DRIVE OUTPUT
720
750
1.12
–4
0.1
780 mV
MΩ
4 mV
V_DRVH
V_DRVL
I_DRV
GATE high saturation
GATE low saturation
Peak souce current
Peak sink current
Rise time
t_DV
Fall time
THERMAL SHUTDOWN
I_GATE = 50 mA
I_GATE = 100 mA
GATE = V_CC/2
GATE = V_CC/2
C_load = 1 nF
C_load = 1 nF
0.24
0.22
–0.77
0.88
15
15
0.5
V
0.5
A
ns
Thermal shutdown temperature
T_SD
Thermal shutdown hysteresis
See ⁽¹⁾
165
°C
20
(1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design. In applications where high power dissipation
and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient
temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP = 125°C), the maximum power dissipation
of the device in the application (P_D-MAX), and the junction-to ambient thermal resistance of the part/package in the application (R_θJA), as
given by the following equation: T_A-MAX = T_J-MAX-OP – (R_θJA × P_D-MAX).
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