LM3444_15 Datasheet, PDF (4/27 Pages) Texas Instruments – AC-DC Offline LED Driver

LM3444
SNVS682D – NOVEMBER 2010 – REVISED DECEMBER 2015
6 Specifications
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6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾
V_CC and GATE to GND
ISNS to GND
FILTER and COFF to GND
COFF input current
Continuous power dissipation⁽³⁾
T_J
Junction temperature
Maximum lead temperature (soldering)
T_stg
Storage temperature
MIN
MAX
–0.3
14
–0.3
2.5
–0.3
7
60
Internally limited
150
260
–65
150
UNIT
V
V
V
mA
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J = 165°C (typical) and
disengages at T_J = 145°C (typical).
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±2000
±1250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
V_CC
T_J
Junction temperature
MIN
MAX UNIT
8
13 V
–40
125 °C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LM3444
DGS (VSSOP)
D (SOIC)
UNIT
10 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
163.8
58.4
83.6
6.1
82.3
111.3
58.0
51.1
11.9
51.0
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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