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DRV5032_17 Datasheet, PDF (5/33 Pages) Texas Instruments – Ultra-Low-Power Digital-Switch Hall Effect Sensor
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7 Specifications
DRV5032
SLVSDC7A – APRIL 2017 – REVISED MAY 2017
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
Power supply voltage
Power supply voltage slew rate
Output voltage
Output current
Magnetic flux density, BMAX
Junction temperature, TJ
Storage temperature, Tstg
VCC
VCC
OUT, OUT1, OUT2
OUT, OUT1, OUT2
MIN
MAX
–0.3
5.5
Unlimited
–0.3
–5
VCC + 0.3
5
Unlimited
105
–65
150
UNIT
V
V / µs
V
mA
T
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-
C101 (2)
VALUE
±6000
±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VCC
Power supply voltage
VO
Output voltage
IO
Output current
TA
Operating ambient temperature
MIN
MAX UNIT
1.65
5.5
V
0
5.5
V
–5
5
mA
–40
85
°C
7.4 Thermal Information
THERMAL METRIC(1)
DRV5032
SOT-23 (DBZ)
X2SON (DMR)
UNIT
3 PINS
4 PINS
RθJA
RθJC(top)
RθJB
ψJT
ψJB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
356
159
°C/W
128
77
°C/W
94
102
°C/W
11.4
0.9
°C/W
92
100
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Copyright © 2017, Texas Instruments Incorporated
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