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BQ2947_17 Datasheet, PDF (5/27 Pages) Texas Instruments – Overvoltage Protection for 2-Series to 4-Series Cell Li-Ion Batteries with External Delay Capacitor
bq2947
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7 Specifications
SLUSB15F – SEPTEMBER 2012 – REVISED JANUARY 2017
7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)(1)
Supply voltage
VDD–VSS
Input voltage
V4–V3, V3–V2, V2–V1, V1–VSS, or CD–VSS
Output voltage
OUT–VSS
Continuous total power dissipation, PTOT
Lead temperature (soldering, 10 s), TSOLDER
Storage temperature, Tstg
MIN
MAX
–0.3
30
–0.3
30
–0.3
30
See Thermal Information
300
–65
150
UNIT
V
V
V
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
Over-operating free-air temperature range (unless otherwise noted)
Supply voltage, VDD
Input voltage range
V4–V3, V3–V2, V2–V1, V1–VSS, or CD–VSS
Operating ambient temperature range, TA
MIN
MAX
UNIT
3
20
V
0
5
V
–40
110
°C
7.4 Thermal Information
THERMAL METRIC(1)
bq2947
WSON
UNIT
8 PINS
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bottom)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
62
°C/W
72
°C/W
32.5
°C/W
1.6
°C/W
33
°C/W
10
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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